BOND TYPE
BOND SYSTEM
ATTRIBUTES
Resin Bonds
B100
General purpose phenolic resin bond
Applications: General purpose wet grinding with diamond or CBN
B110
Dry grinding phenolic resin bond
Applications: Dry grinding carbide
B120
Centerless and high contact area phenolic resin grinding bond
Applications: Centerless or high contact area grinding
B200
Free-cutting phenolic resin bond
Applications: Very free cutting grinding with fine grit sizes
B210
Dry lubricant phenolic resin bond
Applications: 11V9 cup wheels, tool sharpening
Polyimide Resin Bonds
H400
Polyimide resin bond
Applications: Carbide insert periphery grinding
P500
Polyimide resin bond
Applications: Blanchard grinding, creep feed grinding
Metal Bonds
M180
Free-cutting crushable metal bond
Applications: Crushable form grinding, difficult to grind ceramics
M250
Soft metal bond for high contact area grinding
Applications: Blanchard grinding of ceramic and glass materials
M400
Bronze bond specifically for fine grit form holding (325 grit or finer)
Applications: Corner holding and form retention on fine grit diamond
M500
Bronze bond for ceramics and glass (up to 18" OD on 1A1 and 1A1R)
Applications: Blanchard, surface, and cut-off grinding operations
Electroplated Bonds
E
Standard plating process
Applications: All electroplated diamond and CBN grinding wheels
E40
Plating process with less nickel coverage for greater abrasive exposure
Applications: Nickel-based aerospace alloy creepfeed grinding
EHT
Precision plating process for tight-tolerance, fine grit size forms
Applications: Thread form generating wheels










Bond System
Greenlee Diamond Tool Company, Inc. All rights reserved.
2375 Touhy Ave, Elk Grove Village, IL 60007
Telephone: (866) 451-3316 Fax: (847) 593-3165