BOND TYPE | BOND SYSTEM | ATTRIBUTES |
Resin Bonds | B100 | General purpose phenolic resin bond Applications: General purpose wet grinding with diamond or CBN |
B110 | Dry grinding phenolic resin bond Applications: Dry grinding carbide | |
B120 | Centerless and high contact area phenolic resin grinding bond Applications: Centerless or high contact area grinding | |
B200 | Free-cutting phenolic resin bond Applications: Very free cutting grinding with fine grit sizes | |
B210 | Dry lubricant phenolic resin bond Applications: 11V9 cup wheels, tool sharpening | |
Polyimide Resin Bonds | H400 | Polyimide resin bond Applications: Carbide insert periphery grinding |
P500 | Polyimide resin bond Applications: Blanchard grinding, creep feed grinding | |
Metal Bonds | M180 | Free-cutting crushable metal bond Applications: Crushable form grinding, difficult to grind ceramics |
M250 | Soft metal bond for high contact area grinding Applications: Blanchard grinding of ceramic and glass materials | |
M400 | Bronze bond specifically for fine grit form holding (325 grit or finer) Applications: Corner holding and form retention on fine grit diamond | |
M500 | Bronze bond for ceramics and glass (up to 18″ OD on 1A1 and 1A1R) Applications: Blanchard, surface, and cut-off grinding operations | |
Electroplated Bonds | E | Standard plating process Applications: All electroplated diamond and CBN grinding wheels |
E40 | Plating process with less nickel coverage for greater abrasive exposure Applications: Nickel-based aerospace alloy creepfeed grinding | |
EHT | Precision plating process for tight-tolerance, fine grit size forms Applications: Thread form generating wheels |